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MP03TT300
MP03TT300
Dual Thyristor Water Cooled Module Preliminary Information
DS5428-1.1 June 2001
FEATURES
s s s s s s
Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink
KEY PARAMETERS VDRM IT(AV) ITSM(per arm) IT(RMS) Visol
1800V 310A 8100A 490A 3000V
G1 K1 K2 G2
1
2
3
APPLICATIONS
s s s s
Fig. 1 Circuit diagram
Motor Control Controlled Rectifier Bridges Heater Control AC Phase Control
VOLTAGE RATINGS
Type Number Repetitive Peak Voltages VDRM VRRM V 1800 1700 1600 1500 Conditions
MP03TT300-18 MP03TT300-17 MP03TT300-16 MP03TT300-15
Tvj = 0 to 125C, IDRM = IRRM = 30mA VDSM = VRSM = VDRM = VRRM + 100V respectively
Outline type code: MP03 - W1 or W2 Outline type code: MP03 - W3 or W4
Lower voltage grades available
ORDERING INFORMATION
Order As: MP03TT300-XX W1 MP03TT300-XX W2 MP03TT300-XX W3 MP03TT300-XX W3A MP03TT300-XX W4 With 1/4 BSP connection 1/4 - 18 NPT connection 1/4 - 18 NPT connection 1/4 - 18 NPT water connection thread With 1/4 BSP connection
XX shown in the part number about represents VDRM/100 selection required, e.g. MP03TT300-16-W3 Note: When ordering, please use the whole part number. Auxiliary gate and cathode leads can be ordered separately.
Outline type code: MP03 - W3A
(See package details for further information) Fig. 2 Electrical connections - (not to scale)
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MP03TT300
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Symbol IT(AV) Parameter Mean on-state current Test Conditions Half wave resistive load, 4.5 Ltr/min Twater (in) = 25C Twater (in) = 40C Twater (in) = 50C IT(RMS RMS value Twater (in) = 25C @ 4.5 Ltr/min Twater (in) = 40C @ 4.5 Ltr/min ITSM I2t ITSM I2t Visol Surge (non-repetitive) on-current I2t for fusing Surge (non-repetitive) on-current I2t for fusing Isolation voltage 10ms half sine, Tj = 125C VR = 0 10ms half sine, Tj = 125C VR = 50% VDRM Commoned terminals to base plate. AC RMS, 1 min, 50Hz Max. 360 310 280 565 490 8.1 0.33x106 6.5 0.21x106 3000 Units A A A A A kA A2s kA A2s V
THERMAL AND MECHANICAL RATINGS
Symbol Rth(j-w) Parameter Thermal resistance - junction to water (per thyristor) Test Conditions dc, 4.5 Ltr/min Half wave, 4.5 Ltr/min 3 Phase, 4.5 Ltr/min Tvj Tstg Virtual junction temperature Storage temperature range Screw torque Mounting - M6 Electrical connections - M4 Weight (nominal) Reverse (blocking) Min. -40 5(44) 8(70 Max. 0.175 0.185 0.195 125 125 9(80) Refer to drawing Units C/kW C/kW C/kW C C Nm (lb.ins) Nm (lb.ins) g
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MP03TT300
DYNAMIC CHARACTERISTICS
Symbol IRRM/IDRM dV/dt dI/dt Parameter Peak reverse and off-state current Linear rate of rise of off-state voltage Rate of rise of on-state current Test Conditions At VRRM/VDRM, Tj = 125C To 67% VDRM, Tj = 125C From 67% VDRM to 500A, gate source 10V, 5 tr = 0.5s, Tj = 125C VT(TO) rT Threshold voltage On-state slope resistance At Tvj = 125C At Tvj = 125C 0.93 0.67 V m Min. Max. 30 1000 500 Units mA V/s A/s
Note: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor.
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol VGT IGT VGD VFGM VFGN VRGM IFGM PGM PG(AV) Parameter Gate trigger voltage Gate trigger current Gate non-trigger voltage Peak forward gate voltage Peak forward gate voltage Peak reverse gate voltage Peak forward gate current Peak gate power Mean gate power Test Conditions VDRM = 5V, Tcase = 25oC VDRM = 5V, Tcase = 25oC At VDRM Tcase = 125oC Anode positive with respect to cathode Anode negative with respect to cathode Anode positive with respect to cathode See table fig. 5 Max. 3 150 0.25 30 0.25 5 10 100 5 Units V mA V V V V A W W
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MP03TT300
1600 Measured under pulse conditions 1400 1200 1000 800 600 400 200 0 0.5
20 I2t = I2 x t 2
Peak half sine wave on-state current - (kA)
Instantaneous on-state current, IT - (A)
15
300
Tj = 125C
I2t value - (A2s x 103)
10
250
5
I2t
200
1.0 1.5 Instantaneous on-state voltage, VT - (V)
2.0
0 1 ms
10
1
2
3 45 Cycles at 50Hz
150 50
Duration
Fig. 3 Maximum (limit) on-state characteristics
Fig. 4 Surge (non-repetitive) on-state current vs time (with 50% VRSM at Tcase = 125C)
100
Thermal resistance (junction to water). Rth(j-w) - (C/W)
Gate trigger voltage, VGT - (V)
Pulse width Frequency Hz Table gives pulse power PGM in Watts s 50 100 400 20 100 100 100 25 100 100 100 100 100 100 100 500 100 100 25 1ms 100 50 12.5 10 10ms 10 - -
1.0
0W 10 W 50
W 20 W 10 5W
0.1
er Upp
1
l imi
t 95
%
0.01
VGD 0.1 0.001
L ow
er lim
it 5%
Tj = 125C
Tj = 25C Tj = -40C
Region of certain triggering
0.01
0.1
1
10
0.001 0.001
0.01
0.1
Gate trigger current, IGT - (A)
1 Time - (s)
10
100
1000
Fig. 5 Gate characteristics
Fig. 6 Transient thermal impedance - dc
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MP03TT300
1800 60 1600 Conduction Angle 30
On-state power loss per device - (W)
1200
90
120 180
1100 Conduction Angle 30 1000
On-state power loss per device - (W)
60
180 90 120
dc
1400 1200 1000 800 600 400 200 0 0 200 400 600 Mean on-state current, IT(AV) - (A) 800
900 800 700 600 500 400 300 200 100 0 0 200 400 600 Mean on-state current, IT(AV) - (A) 800
Fig. 7 On-state power loss per arm vs on-state current at specified conduction angles, sine wave 50/60Hz
120
Fig. 8 On-state power loss per arm vs on-state current at specified conduction angles, square wave 50/60Hz
120
Max. permissible water inlet temperature - (C @ 4.5 l/min)
Max. permissible water inlet temperature - (C @ 4.5 l/min)
110 100 90 80 70 60 50 40 30 20 10 0 0 100 200 300 400 Mean on-state current, IT(AV) - (A) 500 Conduction Angle 30
110 100 90 80 70 60 50 40 30 20 10 0 0 100 200 300 400 Mean on-state current, IT(AV) - (A) 500 Conduction Angle 30
60 90 120 180
60 90 120
180
dc
Fig. 9 Maximum permissible water inlet temperature vs on-state current at specified conduction angles, sine wave 50/60Hz
Fig. 10 Maximum permissible water inlet temperature vs on-state current at specified conduction angles, square wave 50/60Hz
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MP03TT300
2400 2200 Inductive load 2000 1800
Total power loss - (W)
1600 1400 Resistive load 1200 1000 800 600 400 200 0 0 20 40 60 80 100 120 Max. water inlet temperature - (C) 140 0 100 200 300 400 500 600 700 800 900 1000 DC output current - (A)
Fig. 11 50/60Hz single phase bridge DC output current vs power loss and maximum permissible water inlet temperature for specified values of heatsink thermal resistance
2400 2200 2000 1800
Total power loss - (W)
Resistive load or Inductive load
1600 1400 1200 1000 800 600 400 200 0 0 20 40 60 80 100 120 Max. water inlet temperature - (C) 140 0 100 200 300 400 500 600 700 800 900 1000 DC output current - (A)
Fig. 12 Fig. 11 50/60Hz Three phase bridge DC output current vs power loss and maximum permissible water inlet temperature for specified values of heatsink thermal resistance
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MP03TT300
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
28.5 5 35 42.5 O5.5
5
K2 G2 G1 K1 1 2 3 Fast on tabs 2.8 x 0.8 80 92 M8
Recommended fixings for mounting: M5 socket head cap screws Nominal weight: 1100g Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately. Module outline type code: MP03-W1 and W2
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6.5 5 61 19 25
18 41
Thread size: W1 : 1/4 BSP connection W2 : 1/4 - 18 NPT connection
38
50
27.5
37
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MP03TT300
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
28.5 5 35 42.5 O5.5
5 K2 G2 G1 K1 5 Fast on tabs 2.8 x 0.8 80 92 M8 1 2 3 6.5 61 41 19 9 18 38 50 27.5 37 Thread size: W3 : 1/4 - 18 NPT connection W4 : 1/4 BSP connection
Recommended fixings for mounting: M5 socket head cap screws Nominal weight: 1100g Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately. Module outline type code: MP03-W3 and W4
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MP03TT300
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
42.5 O5.5 35 28.5 5
5
Fast on tabs 2.8 x 0.8
K1
80 92 M8
6.5 10.37 25.4 67.4
50
38
47.4
18
3
2
1
K2 G2 G1
Thread size: W3A : 1/4 - 18 NPT connection thread
20.6
50.8
Recommended fixings for mounting: M5 socket head cap screws Nominal weight: 1300g Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately. Module outline type code: MP03-W3A
5
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MP03TT300
POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of Dynex semiconductors. An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontarion, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2001 Publication No. DS5428-1 Issue No. 1.1 June 2001 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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